Intel Corporation

Applied Materials, Inc.

Metal Matrix Cast Composites, Inc.

Himanshu Pokharna

Eric DiStefano

Rajiv K Mongia

Je-Young Chang

Ravi S Prasher

Srinivas D Nemani

Gregory Martin Chrysler

Chen-An Chen

Shawn S Mceuen

Sridhar V Machiroutu

Joseph Douglass Walters

Brian A Wilk

Phong Le

Li-Qun Xia

Ellie Y Yieh

Chia-Pin Chiu

Chuan Hu

Son Truong Nguyen

Ioan Sauciuc

James G Maveety

Mark A Fodor

Yoshifumi Nishi

Yen-Kun Victor Wang

John William Horigan

James A Cornie

Inna Shmurun

Anandaroop Bhattacharya

Francimar Campana

Eric Baugh

Shankar W Chandran

Stephen S Cornie

Choong-Un Kim

Kelly Fong

Karen Stafford

Thomas M Rossi

Reuban Richmonds

West M Burghardt

Mark Montesano

Masahiro Kuroda

Marco Beltman

Michael Rocke

In one embodiment, a heat exchanger may be formed using a corrosion-resistant aluminum material to enable usage of water as a working fluid for the exchanger. In one embodiment, the exchanger may have an aluminum substrate with multiple treated layers formed thereon. A first treated layer corresponds to a hydrated aluminum oxide layer, and a second treated layer corresponds to a mono-layer organic molecule layer. Other embodiments are described and claimed.

Enabling an aluminum heat exchanger with a working fluid

Embodiments of the present invention provide composite bodies having a discontinuous graphite preform and at least one silicon-bearing metal alloy infiltrant. Embodiments of the present invention also provide methods for producing such composite bodies. The metal alloy is preferably comprised of aluminum, copper, or magnesium, or combinations thereof. Certain preferred embodiments provide at least one aluminum alloy having from about 5% silicon to about 30% silicon, more preferably from about 11% to about 13% silicon, as an alloying element. Certain presently preferred embodiments provide an aluminum-silicon eutectic composition having about 12.5% silicon. Embodiments of the invention provide composite materials be 'tuned' to more closely match thermal expansion characteristics of a number of semiconductor or integrated circuit materials such as, but not limited to, silicon, alumina, aluminum nitride, gallium nitride, and gallium arsenide while also providing high thermal conductivity. Embodiments of the present invention are especially suited for use as a heat sink, a heat spreader, or both.

Thermally conductive graphite reinforced alloys

Method and apparatus for abating Ffrom by-products generated during cleaning of a processing chamber. Fabatement is efficiently performed by directly injecting Hin line with a foreline exiting the processing chamber. A tube which is highly resistant to oxidation and corrosive gases, even at high temperature, is connected in line with the foreline as part of the exhaust line of the processing chamber. A cooling jacket may be provided for cooling the tube, since the reaction between Fand His exothermic. A pressure monitoring arrangement may also be employed to insure that pressure within a hydrogen line, that feeds the injection of Hinto the tube, does not exceed a predetermined pressure value.

Apparatus for abatement of by-products generated from deposition processes and cleaning of deposition chambers

According to some embodiments, systems for improved blower fans are provided. In some embodiments, systems may include a casing comprising an inlet to accept a fluid and an outlet to evacuate the fluid. The systems may further comprise an impeller disposed within the casing, comprising a hub and one or more impeller blades coupled to the hub. In some embodiments, the inlet of the casing may be shaped to reduce the amount of fluid that evacuates the casing via the inlet due to pressure within the casing.

Systems for improved blower fans

A cooling apparatus may include an attach block manufactured using at least partially a graphite material. The attach block may be coupled to two heat pipes. The graphite material may be positioned in between the two heat pipes and in a direction that enables high heat conductivity and low thermal resistance.

Heat pipe remote heat exchanger (RHE) with graphite block

Apparatus, systems, and methods may operate to distribute acoustic spectral energy associated with a primary blade-passing frequency tonal component of fan noise and with harmonics thereof. The energy may be spectrally distributed by irregularly spacing a plurality of fan blades or stationary structures associated with the fan, or both. The stationary structures may be capable of being pressure-coupled to each one of the plurality of fan blades as each fan blade passes by each one of the stationary structures. Other embodiments are described and claimed.

Cooling fan noise reduction apparatus, systems, and methods

A system to improve display efficiency based on recycling a local heat source. In one embodiment, the system includes a display and a lamp to illuminate the display. Heat from a heat generating component within the system in transferred to the lamp. In one embodiment, the lamp is a cold cathode fluorescent lamp (CCFL). The heat can be transferred to the lamp via conduction or convection.

System to improve display efficiency based on recycling local heat source

An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.

Enhanced flow channel for component cooling in computer systems

An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.

IC coolant microchannel assembly with integrated attachment hardware

A notebook computer system that utilizes both natural convection and forced convection cooling methods is described. Specifically, at low power levels, the forced convection components are disabled to conserve energy and to reduce noise.

Pumped loop cooling with remote heat exchanger and display cooling

A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

Integrated circuit coolant microchannel assembly with targeted channel configuration

A device may include an integrated circuit chip and channels to carry a coolant. The channels may be proximate to an upper surface of the integrated circuit chip, and the channels may extend along a length of the integrated circuit chip. A density of the channels may change across the length of the integrated circuit chip.

Heat exchanger with cooling channels having varying geometry

According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).

Integrated circuit coolant microchannel with movable portion

An apparatus for using fluid laden with nanoparticles for application in electronic cooling is described. In one embodiment, an electromagnetic pump is used to circulate the nanoparticle laden fluid.

Apparatus for using fluid laden with nanoparticles for application in electronic cooling

Growing community of inventors

San Jose, CA, United States of America

Himanshu Pokharna