Osaka, Japan

Hidenori Aonuma

This inventor holds 4 USPTO granted patents. Top assignee: Nitto-Denko Corporation. Active years: 2006-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hidenori Aonuma. Retrieved from https://idiyas.com/inventor/hidenori-aonuma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 48(Granted Patents)


Location History:

  • Ibaraki, JP (2008)
  • Osaka, JP (2006 - 2009)

Company Filing History:


Years Active: 2006-2009

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovator Hidenori Aonuma: Pioneering Suspension Board Technologies

Introduction: Hidenori Aonuma, an accomplished inventor based in Osaka, Japan, has made significant contributions to the field of circuit board production. With a total of four patents to his name, Aonuma's innovations have played a vital role in enhancing the efficiency and reliability of electronic components. His work is especially notable in the methods used for creating suspension boards, which are crucial for various electronic applications.

Latest Patents: Aonuma's latest patents include a "Production method of suspension board with circuit," which outlines a novel approach to producing a suspension board. This method involves creating an insulating base layer on a metal supporting board, followed by the formation of a conductive pattern that includes ground wiring and signal wiring. An insulating cover layer is then applied, with specific openings that expose ground terminals and connecting portions for electrolytic plating. This innovative technique ensures effective electrical connections while preventing deposition issues.

Another significant patent is the "Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet." This invention addresses the challenges of plating metal on a metal sheet's surface, even with the potential for pinholes in the insulating layer. Aonuma's design features designated areas on the metal sheet for forming both wiring circuit boards and lead wires for electroplating, enhancing production efficiency.

Career Highlights: Aonuma is currently affiliated with Nitto Denko Corporation, a company renowned for its focus on innovative materials and electronic components. His extensive experience in patent development is a testament to his expertise in the field. Over the years, he has successfully secured patents that reflect his commitment to advancing technology in circuit design and production methods.

Collaborations: Throughout his career, Hidenori Aonuma has had the privilege of collaborating with accomplished professionals such as Yasuhito Ohwaki and Tetsuya Ohsawa. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies in the electronic circuit domain.

Conclusion: Hidenori Aonuma stands out as a remarkable inventor whose patents have significantly influenced circuit board production methods. Through his innovative strategies and collaborations, he continues to pave the way for advancements in electronic technology. His work exemplifies the spirit of innovation, showcasing the importance of creativity and collaboration in the realm of engineering and invention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…