Nitto-Denko Corporation

Hidenori Aonuma

Yasuhito Ohwaki

Tetsuya Ohsawa

A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.

Production method of suspension board with circuit

The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheetof the present invention has a metal sheet, multiple wiring circuit board forming areaA in compartments on the metal sheet and areaB for forming a lead wire for electroplating, which is in compartment on the metal sheet. Each areaA has a partially completed wiring circuit board. The partially completed wiring circuit boardis equipped with a base insulating layer, a wiring patternand a cover insulating layer. In the areaB, a first insulating layer, a lead wirefor electroplating and a second insulating layerare laminated in this order. Of the metal sheet, an openingis formed in the part under the lead wire

Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet

A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layerhaving a base opening portionis formed on a metal boardat a ground terminalforming position, and a thin metal filmis formed on the metal boardexposed in the base opening portionand on the insulating base layer. Then, a conductive patternis formed on the thin metal film. Then, an insulating cover layercovering the conductive patternand having a cover opening portionwhich correspond in position to the base opening portionis formed on the insulating base layer. Then, a metal board opening portionfrom which the base opening portionand the insulating base layeraround it are exposed is formed in the metal board. Then, an electrolytic plating layeris formed on each side of the conductive patternexposed in the cover opening portion, feeding electric power from the conductive pattern, and a metal filling layeris formed in the metal board opening portion, to allow the electrolytic plating layerand the metal boardto be conductive with each other.

A suspension board with circuit permits a terminal portion to be formed by electrolysis plating without exposing a conductor layer to outside and a production method thereof. After an insulating base layer is formed on a suspension board in a specific pattern in which a second opening is formed, a thin metal film is formed on the insulating base layer and on the suspension board including the second opening exposed from the insulating base layer. A conductor layer is formed in the form of a wired circuit pattern on the thin metal film. An insulating cover layer is formed with a pad opening therein, and a pad portion formed in the pad opening using the suspension board as a lead portion of the electrolysis plating. A first opening larger than the second opening is formed in the suspension board at a portion thereof corresponding to the second opening.

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Osaka, Japan

Hidenori Aonuma