The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2008

Filed:

Aug. 03, 2005
Applicants:

Hidenori Aonuma, Ibaraki, JP;

Tetsuya Ohsawa, Ibaraki, JP;

Yasuhito Ohwaki, Ibaraki, JP;

Inventors:

Hidenori Aonuma, Ibaraki, JP;

Tetsuya Ohsawa, Ibaraki, JP;

Yasuhito Ohwaki, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Ibaraki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheetof the present invention has a metal sheet, multiple wiring circuit board forming areaA in compartments on the metal sheet and areaB for forming a lead wire for electroplating, which is in compartment on the metal sheet. Each areaA has a partially completed wiring circuit board. The partially completed wiring circuit boardis equipped with a base insulating layer, a wiring patternand a cover insulating layer. In the areaB, a first insulating layer, a lead wirefor electroplating and a second insulating layerare laminated in this order. Of the metal sheet, an openingis formed in the part under the lead wire


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