The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Jun. 21, 2005
Hidenori Aonuma, Osaka, JP;
Yasuhito Ohwaki, Osaka, JP;
Hidenori Aonuma, Osaka, JP;
Yasuhito Ohwaki, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layerhaving a base opening portionis formed on a metal boardat a ground terminalforming position, and a thin metal filmis formed on the metal boardexposed in the base opening portionand on the insulating base layer. Then, a conductive patternis formed on the thin metal film. Then, an insulating cover layercovering the conductive patternand having a cover opening portionwhich correspond in position to the base opening portionis formed on the insulating base layer. Then, a metal board opening portionfrom which the base opening portionand the insulating base layeraround it are exposed is formed in the metal board. Then, an electrolytic plating layeris formed on each side of the conductive patternexposed in the cover opening portion, feeding electric power from the conductive pattern, and a metal filling layeris formed in the metal board opening portion, to allow the electrolytic plating layerand the metal boardto be conductive with each other.