Location History:
- Kanagawa, JP (1995)
- Fujisawa, JP (1999 - 2001)
- Tokyo, JP (2002 - 2010)
Company Filing History:
15 out of 2,514 
1 out of 164,244 
Years Active: 1995-2010
Title: Innovations of Hidenao Suzuki in Plating Technology
Introduction
Hidenao Suzuki is a prominent inventor based in Tokyo, Japan, known for his significant contributions to plating technology. With a total of 15 patents to his name, Suzuki has developed innovative methods and apparatuses that enhance the efficiency and quality of plating processes.
Latest Patents
One of his latest patents is a plating apparatus designed to securely carry out flattening plating of a substrate. This apparatus forms a plated film with a flat surface without the need for costly mechanisms or extra plating. The design includes a substrate holder, a cathode section with a seal member for watertight sealing, and a cathode electrode for supplying electric current. Additionally, an anode is positioned facing the substrate's surface, with a porous member placed between them. The apparatus features a constant-voltage control section to maintain a steady voltage and a current monitor section to track the electric current flow.
Another notable patent is a plating method that allows for the preferential precipitation of a plated film in trenches and via holes. This method utilizes a mechanical and electrochemical process to create a plated film with a higher flatness surface, unaffected by variations in trench and via hole shapes. The method consists of a first and a second plating process, where the second process involves filling a plating solution between an anode and a substrate, with a porous member repeatedly brought into contact with the substrate while passing current.
Career Highlights
Hidenao Suzuki has worked with notable companies such as Ebara Corporation and IBM. His experience in these organizations has contributed to his expertise in the field of plating technology and innovation.
Collaborations
Throughout his career, Suzuki has collaborated with talented individuals, including Kuniaki Horie and Tsutomu Nakada. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in plating.
Conclusion
Hidenao Suzuki's innovative work in plating technology has significantly advanced the field, showcasing his expertise and dedication to improving manufacturing processes. His contributions continue to influence the industry and inspire future innovations.