The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2009
Filed:
Dec. 23, 2004
Mizuki Nagai, Tokyo, JP;
Hiroyuki Kanda, Tokyo, JP;
Keiichi Kurashina, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Hidenao Suzuki, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Brett C. Baker-o'neal, Sleepy Hollow, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Keith Kwietniak, Highland Falls, NY (US);
Mizuki Nagai, Tokyo, JP;
Hiroyuki Kanda, Tokyo, JP;
Keiichi Kurashina, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Hidenao Suzuki, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Brett C. Baker-O'Neal, Sleepy Hollow, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Keith Kwietniak, Highland Falls, NY (US);
Ebara Corporation, Tokyo, JP;
Abstract
A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.