The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Oct. 07, 2005
Keiichi Kurashina, Tokyo, JP;
Mizuki Nagai, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Hiroyuki Kanda, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Shinya Morisawa, Tokyo, JP;
Junji Kunisawa, Tokyo, JP;
Kunihito Ide, Tokyo, JP;
Hidenao Suzuki, Tokyo, JP;
Emanuel Cooper, Scarsdale, NY (US);
Philippe Vereecken, Leuven, BE;
Brett Baker-o'neal, Sleepy Hollow, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Keiichi Kurashina, Tokyo, JP;
Mizuki Nagai, Tokyo, JP;
Satoru Yamamoto, Tokyo, JP;
Hiroyuki Kanda, Tokyo, JP;
Koji Mishima, Tokyo, JP;
Shinya Morisawa, Tokyo, JP;
Junji Kunisawa, Tokyo, JP;
Kunihito Ide, Tokyo, JP;
Hidenao Suzuki, Tokyo, JP;
Emanuel Cooper, Scarsdale, NY (US);
Philippe Vereecken, Leuven, BE;
Brett Baker-O'Neal, Sleepy Hollow, NY (US);
Hariklia Deligianni, Tenafly, NJ (US);
Ebara Corporation, Tokyo, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.