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For the Inventor, By the Inventor

Kanagawa, Japan

Hideji Miyanishi

This inventor holds 9 USPTO granted patents and 1 published patent application. Top assignee: Ricoh Company, Ltd.. Active years: 1991-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hideji Miyanishi. Retrieved from https://idiyas.com/inventor/hideji-miyanishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 33.3

Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 45(Granted Patents)


Location History:

  • Toyonaka, JP (1991 - 1996)
  • Yokohama, JP (2010 - 2011)
  • Kanagawa, JP (2008 - 2013)

Company Filing History:

goldMedal9 out of 28,934 
 
Ricoh Company, Ltd.
 patents

Years Active: 1991-2013

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9 patents (USPTO):Explore Patents
1. 8605448 - Printed wiring board (2013-12-10),
2. 8030580 - Printed wiring board and electronic apparatus including same (2011-10-04),
3. 7643980 - Electromagnetic field analysis apparatus, method and computer program (2010-01-05),
4. 7598747 - Noise injection apparatus for printed circuit board (2009-10-06),
5. 7355413 - Testing method/arrangement measuring electromagnetic interference of noise in a to-be-tested printed circuit board (2008-04-08),
6. 7338290 - Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads (2008-03-04),
7. 5550493 - Potential comparing circuit having an offset correcting circuit (1996-08-27),
8. 5369614 - Detecting amplifier with current mirror structure (1994-11-29),
9. 5018105 - Semiconductor memory device (1991-05-21),

Title: Innovations by Hideji Miyanishi

Introduction

Hideji Miyanishi is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of printed wiring boards, holding a total of 9 patents. His work focuses on enhancing the performance and efficiency of electronic devices through innovative designs.

Latest Patents

Miyanishi's latest patents include a printed wiring board that features a bridge located in a surface layer, along with a noise absorber positioned on the bridge. This design incorporates multiple grounds that are either directly connected or high-frequency-connected to the bridge. Additionally, it includes a first device that utilizes one of the grounds as a reference potential and a second device that uses a different ground for its reference potential. The high-speed signal line connecting these devices is routed through a layer adjacent to the bridge, forming a transmission line structure. Another significant patent involves a printed wiring board designed for electronic apparatuses, which includes a pair of signal pads for transmitting differential signals and a ground pad strategically placed near these signal pads. This design ensures effective grounding through a via that connects the ground pad to a ground pattern on the back side or inner layer of the board.

Career Highlights

Miyanishi is currently employed at Ricoh Company, Ltd., where he continues to innovate in the field of electronics. His work has been instrumental in developing advanced technologies that improve the functionality of electronic devices.

Collaborations

Miyanishi has collaborated with several talented individuals in his field, including Kenji Motohashi and Kazumasa Aoki. These collaborations have contributed to the success of his projects and the advancement of technology in printed wiring boards.

Conclusion

Hideji Miyanishi's contributions to the field of printed wiring boards demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic design and a drive to enhance device performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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