The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2008
Filed:
Oct. 25, 2006
Applicants:
Kenji Motohashi, Kanagawa, JP;
Takashi Yanagimoto, Kanagawa, JP;
Hideji Miyanishi, Kanagawa, JP;
Kazumasa Aoki, Kanagawa, JP;
Inventors:
Kenji Motohashi, Kanagawa, JP;
Takashi Yanagimoto, Kanagawa, JP;
Hideji Miyanishi, Kanagawa, JP;
Kazumasa Aoki, Kanagawa, JP;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A design rule for a printed wiring board is provided. A conductive layer and a pad are separate from each other in a distance defined by the design rule, which sufficiently prevents the capacitance coupling between the conductive layer and the pad.
Motohashi, Kenji. (2008). Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads (U.S. Patent No. 7338290). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7338290
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile