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For the Inventor, By the Inventor

Kawasaki, Japan

Hidehisa Sakai

USPTO Granted Patents = 14 

Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 170(Granted Patents)


Location History:

  • Kawasaki, JP (1994 - 2018)
  • Sagamihara, JP (2016 - 2020)

Company Filing History:

goldMedal14 out of 39,228 
 
Fujitsu Corporation
 patents

Years Active: 1994-2020

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14 patents (USPTO):Explore Patents
1. 10575392 - Cooling system (2020-02-25),
2. 9990445 - Decoupled parallel meshing in computer aided design (2018-06-05),
3. 9471716 - Setting method and information processing apparatus (2016-10-18),
4. 8816510 - Semiconductor apparatus, substrate design method, and substrate design apparatus (2014-08-26),
5. 8204699 - Analyzing apparatus, analyzing method, and computer-readable recording medium storing an analyzing program (2012-06-19),
6. 8190378 - Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program (2012-05-29),
7. 7873501 - Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program (2011-01-18),
8. 7773814 - Multi-scale analysis device (2010-08-10),
9. 7725866 - Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recorded (2010-05-25),
10. 7467076 - Apparatus for predicting reliability in electronic device package, program for predicting reliability in electronic device package, and method for predicting reliability in electronic device package (2008-12-16),
11. 7139678 - Method and apparatus for predicting board deformation, and computer product (2006-11-21),
12. 5738550 - Press-fit pin fitting in a miniaturized through hole formed in a circuit (1998-04-14),
13. 5475922 - Method of assembling a connector using frangible contact parts (1995-12-19),
14. 5354209 - Connector and method of assembling the same (1994-10-11),

Title: Innovations of Hidehisa Sakai

Introduction

Hidehisa Sakai is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of technology, holding a total of 14 patents. His work primarily focuses on advanced cooling systems and innovative meshing methods in computer-aided design.

Latest Patents

One of his latest patents is a cooling system that includes a heat exchanger designed to be larger than the heat generating component. This system features a leaf spring that extends from one side of the heat exchanger to the other, securing it to a printed circuit board. Additionally, it incorporates a convex portion that is raised higher than other parts, enhancing its functionality. Another notable patent is related to decoupled parallel meshing in computer-aided design. This method utilizes serial meshing units to automate the meshing process for CAD assembly models, improving efficiency by using live runtime information.

Career Highlights

Hidehisa Sakai is currently employed at Fujitsu Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of cooling systems and CAD processes.

Collaborations

He has collaborated with notable coworkers, including Akira Tamura and Mikio Nishihara, contributing to various projects that enhance technological advancements.

Conclusion

Hidehisa Sakai's contributions to technology through his patents and innovations reflect his expertise and dedication to the field. His work continues to influence advancements in cooling systems and computer-aided design.

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