Fujitsu Corporation

Hidehisa Sakai

Akira Tamura

Kyoichiro Kawano

Makoto Sakairi

Mikio Nishihara

Yoko Kobayashi

Yoshiteru Ochi

Takeshi Okuyama

Takeshi Nishiyama

Noriyuki Matsui

Tetsuyuki Kubota

Peter Chow

Akihiko Fujisaki

Serban Georgescu

Tsutomu Iikawa

Masahiko Sakuraoka

Masanori Motegi

Sachiko Furuya

Takamasa Shinde

Kazuhisa Inagaki

Katsufumi Morimune

A cooling system includes a heat exchanger provided on a heat generating component, the heat exchanger having a size larger than the heat generating component, a leaf spring to extend from a first side of an upper surface of the heat exchanger to a second side opposite to the first side, and be fixed to the upper surface of the heat exchanger, a first screw to be arranged around the heat exchanger, and to fix the leaf spring to a printed circuit board, and a convex portion to be raised to be higher than a first portion of the first side and a second portion of the second side, and to be formed at a central portion between first and second portions within a region of the upper surface of the heat exchanger that overlaps with the leaf spring.

Cooling system

In a meshing method for use in a computer-aided design (CAD) or computer-aided engineering (CAE) system, in which one or more serial meshing units are used to carry out a decoupled parallel meshing process in respect of all parts of a CAD assembly model, input parameters for the meshing process automatically, for each part to be processed, are set using live runtime information about the meshing process for the part concerned, such as information about the outcome of previous attempts to carry out the meshing process of the part.

Decoupled parallel meshing in computer aided design

A disclosed setting method includes: in response to an instruction to replace a first component with a second component, determining whether or not data that correlates a surface of the first component with a surface of a third component has been set; upon determining that the data that correlates the surface of the first component with the surface of the third component has been set, extracting a surface of the second component, which corresponds to the surface of the first component; and correlating the extracted surface of the second component with the surface of the third component instead of the surface of the first component in the data.

Setting method and information processing apparatus

A semiconductor apparatus including: a substrate; and a semiconductor chip mounted on the substrate, wherein the substrate has plural holes, and the plural holes are provided such that the density on a substrate surface of the holes in a first area, which is an area of the substrate facing a semiconductor chip peripheral portion, is higher than the density on the substrate surface of the holes in an area excluding the first area on the substrate.

Semiconductor apparatus, substrate design method, and substrate design apparatus

An analyzing method includes acquiring displacements with respect to loads applied of the test piece measured by the three-point bending test; calculating a first approximate expression of a relation of the displacements with respect to the loads applied in a first area where the relation is linear so as to determine an elasticity modulus of the test piece; extracting boundary value of a relation of strains caused by the displacements with respect to the loads so as to determine a yield stress value of the test piece; and calculating a second approximate expression of a relation of stress caused by the loads with respect to the strains caused by the displacements in a second area beyond the yield stress value on the basis of the yield stress value, the elasticity modulus, and the measurements in the second area.

Analyzing apparatus, analyzing method, and computer-readable recording medium storing an analyzing program

An element damage determination unit calculates a cumulative value of a damage value using a Manson-Coffin law for a plurality of finite elements of a continuum based on a result of a stress/distortion analyzing process, and determines whether or not the cumulative value of the damage value is equal to or exceeds a threshold. A calculation unit obtains first correspondence information indicating the correspondence between the number of cycles of a load and a growth rate of a crack occurring in the continuum based on the determination result. A Manson-Coffin law change unit changes a Manson-Coffin law based on the first correspondence information and second correspondence information indicating the correspondence between an actual measurement value of the number of cycles of a load applied to the continuum and an actual measurement value of the growth rate of a crack occurring in the continuum at that time.

Crack growth evaluation apparatus, crack growth evaluation method, and recording medium recording crack growth evaluation program

The analysis model generation unit generates an analysis model for use in an analysis by a finite-element method. A stress distortion analysis unit analyzes a stress and a distortion occurring in finite elements of a continuum by a load using the analysis model for each load cycle cyclically applied to the continuum by the finite-element method. An element damage evaluation unit evaluates a damage by the distortion on the finite elements of the continuum based on the analysis result for each load cycle. A crack growth display unit displays the growth of a crack occurring in the continuum based on a result of the evaluation of the damage.

The distortion of each node is calculated from the distortions of respective elements in the finite element analysis result of a global model of a structure, and a second-order coefficient of a quadratic function representing the displacement at each node of a micro model is calculated from distortions of respective nodes. In addition, a constant term and a first-order coefficient of the quadratic function are calculated from the displacements of the respective nodes of the global model. Then, the displacement at each boundary node of the micro model is calculated using the obtained quadratic function and a finite element analysis of the micro model is performed.

Multi-scale analysis device

When reliability evaluation of the whole electronic package is performed, the time required for simulation is decreased, while solder connection parts, in particular, are accurately analyzed. The whole analysis model creating unit creates a solder connection part model which has the same volume, height, and connection area as the volume, height, and connection area of the solder connection part. By means of dividing the solder connection model into multiple meshes, the first mesh data for use in electronic package analysis is created.

Electronic package evaluation apparatus, electronic package optimizing apparatus, and computer-readable recording medium in which electronic package evaluation program is recorded

Reliability of an electronic package is predicted based on material type, shape and dimensions of the package and conditions for assessment thereof, and a modeling unit creates a simulation model based thereon. An executing unit uses the simulation model to execute a simulation under designated conditions and results of the simulation are stored in a database. The stored simulation is assessed according to the assessment criteria and the assessment results are stored in a database. A generating unit generates, as an assessment expression, an approximate expression which infers the results of assessment from the inputted parameters, on the assumption that a predetermined amount of results of assessment is preserved. An assessment predicting unit outputs the results of an assessment of a package in which an assessment expression has already been established, by using the assessment expression.

Apparatus for predicting reliability in electronic device package, program for predicting reliability in electronic device package, and method for predicting reliability in electronic device package

An apparatus for predicting a deformation of a board includes a board dividing unit that divides the board into a plurality of areas based on wiring information on the board; and a deformation predicting unit that grasps a wiring pattern of an area macroscopically, calculates an equivalent physical property value equivalent to a modulus of longitudinal elasticity and a coefficient of thermal expansion by a finite element method, and predicts the deformation of the board based on the equivalent physical property value calculated for each of the areas divided by the board dividing unit.

Method and apparatus for predicting board deformation, and computer product

A press-fit pin has a press-fitting portion having a plurality of bending portions which are to be elastically bent so that a bending stress generated in the press-fitting portion is dispersed to the bending portions. The press-fitting portion is to be press fit into a through hole. The press-fitting portion has a plurality of beams extending along a longitudinal axis of the press-fitting portion. The beams are elastically bent along a line parallel to the longitudinal axis when the press-fitting portion is press fit into the through hole. The press-fitting portion has a cross portion extending along the longitudinal axis of the press-fitting portion so as to connect the beams. The cross portion is elastically bent along a line parallel to the longitudinal axis when the press-fitting portion is press fit into the thorough hole.

Press-fit pin fitting in a miniaturized through hole formed in a circuit

A contact pin includes: a pin terminal secured to a stationary base art by press-fitting a press-fitted part into the stationary base part, the pin terminal projecting from the stationary base part and being joined to the board; a contact part inserted into a contact pin through-hole of a movable lock part so that a plug pin terminal is fitted into the contact part; and an auxiliary plate 6 reinforcing the press-fitted part, engaged with the movable lock part and transmitting a force caused by a movement of the movable lock part to the press-fitted part. A connector constructed in the described manner includes a plurality of above-mentioned contact pins.

Growing community of inventors

Kawasaki, Japan

Hidehisa Sakai