Heinz-Peter Wirtz

This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignees: Stats Chippac Pte. Ltd., St-Ericsson Sa. Active years: 2010-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heinz-Peter Wirtz. Retrieved from https://idiyas.com/inventor/heinz-peter-wirtz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 (Patent Applications = 1)

% Patents Active = 81.8

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 10(Granted Patents)

Location History:

Doettingen, CH (2010)
Dottingen, CH (2012 - 2024)

Company Filing History:

8 out of 1,845

Stats Chippac Pte. Ltd.

Years Active: 2010-2024

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12094729 - Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP (2024-09-17),

2. 11961764 - Semiconductor device and method of making a wafer-level chip-scale package (2024-04-16),

3. 11222793 - Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP (2022-01-11),

4. 11011423 - Semiconductor device and method of using a standardized carrier in semiconductor packaging (2021-05-18),

5. 10515828 - Method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP (2019-12-24),

6. 10181423 - Semiconductor device and method of using a standardized carrier in semiconductor packaging (2019-01-15),

7. 9620413 - Semiconductor device and method of using a standardized carrier in semiconductor packaging (2017-04-11),

8. 9496195 - Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP (2016-11-15),

9. 8222722 - Integrated circuit package and device (2012-07-17),

10. 8125074 - Laminated substrate for an integrated circuit BGA package and printed circuit boards (2012-02-28),

11. 7692280 - Portable object connectable package (2010-04-06),

Title: Inventor Heinz-Peter Wirtz

Introduction: Heinz-Peter Wirtz is a renowned inventor hailing from Dottingen, Switzerland, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Heinz-Peter Wirtz holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: Throughout his illustrious career, Heinz-Peter Wirtz has demonstrated a keen ability to transform inventive ideas into tangible solutions that have had a significant impact on the industry.

Collaborations: Heinz-Peter Wirtz has collaborated with leading companies, research institutions, and universities, fostering a culture of innovation and knowledge exchange that has led to remarkable advancements in technology.

Conclusion: Heinz-Peter Wirtz's passion for innovation, coupled with his relentless pursuit of excellence, solidifies his position as a pioneering inventor in the realm of technological advancements.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: