The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Sep. 11, 2009
Applicants:
Nedyalko Slavov, Zurich, CH;
Heinz-peter Wirtz, Dottingen, CH;
Kwei-kuan Kuo, Zurich, CH;
Inventors:
Assignee:
ST-Ericsson SA, Geneva, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A laminated substrate for an integrated circuit package, including a core layer and at least one build-up layer located above only one side of said core layer. An integrated circuit package, including a laminated substrate and including an integrated circuit die placed above the side build-up layer.
Slavov, Nedyalko. (2012). Laminated substrate for an integrated circuit bga package and printed circuit boards (U.S. Patent No. 8125074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8125074
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile