Tokyo, Japan

Harumi Matsuda

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 4(Granted Patents)


Location History:

  • Hiroshima, JP (2018)
  • Tokyo, JP (2020 - 2023)

Company Filing History:


Years Active: 2018-2023

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3 patents (USPTO):Explore Patents

Title: Harumi Matsuda: Innovator in Semiconductor Technology

Introduction

Harumi Matsuda is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. Her work focuses on enhancing the performance and reliability of semiconductor devices through innovative materials and methods.

Latest Patents

Matsuda's latest patents include a photosensitive resin composition, a polyimide production method, and a semiconductor device. The semiconductor device features a copper wiring and an insulating layer that maintains a void area of 10% or less at the copper wiring surface after exposure to specific conditions. The insulating layer incorporates polyimides derived from various chemical structures, ensuring high performance and durability. Additionally, her photosensitive resin composition is designed to minimize void generation at the interface of copper and polyimide layers, thereby preventing short circuits and disconnections.

Career Highlights

Throughout her career, Harumi Matsuda has worked with notable companies such as Asahi Kasei Corporation and Mitsubishi Chemical Corporation. Her experience in these organizations has allowed her to develop cutting-edge technologies that address critical challenges in semiconductor manufacturing.

Collaborations

Matsuda has collaborated with esteemed colleagues, including Tomohiro Yorisue and Yoshito Ido. These partnerships have fostered a creative environment that has led to groundbreaking advancements in her field.

Conclusion

Harumi Matsuda's innovative work in semiconductor technology exemplifies her commitment to advancing the industry. Her patents reflect her expertise and dedication to improving device performance and reliability.

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