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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10719016 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Aug. 18, 2016

Photosensitive resin composition, polyimide production method, and semiconductor device

Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tomohiro Yorisue, Tokyo, JP;

Yoshito Ido, Tokyo, JP;

Taihei Inoue, Tokyo, JP;

Harumi Matsuda, Tokyo, JP;

Assignee:

ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/037 (2006.01); H01L 21/02 (2006.01); G03F 7/038 (2006.01); C08G 73/10 (2006.01); G03F 7/031 (2006.01); H01L 21/311 (2006.01); C08L 79/08 (2006.01); H01L 23/532 (2006.01); G03F 7/20 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/037 (2013.01); C08G 73/1071 (2013.01); C08L 79/08 (2013.01); G03F 7/031 (2013.01); G03F 7/0382 (2013.01); G03F 7/0388 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/311 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); G03F 7/2002 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01);
Abstract

A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of Rto Rindependently represents a hydrogen atom or a monovalent organic group).

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