Asahi Kasei Kabushiki Kaisha

Mitsubishi Chemical Corporation

Mitsubishi Rayon Company, Limited

Harumi Matsuda

Takayuki Kobayashi

Atsushi Nakajima

Kenichi Watanabe

Manabu Kaneko

Masahiro Ichino

Takuya Teranishi

Naoki Aoyama

Kiharu Numata

Tomohiro Yorisue

Yoshito Ido

Yoshiko Irie

Yasuyuki Fujii

Masahiro Hata

Taihei Inoue

Norifumi Hirota

Takeshi Nii

Takayuki Kiriyama

Yuusuke Shinmen

Hiroyuki Nakao

Teppei Miura

Akiyoshi Kogame

Naomasa Matsuyama

Shouhei Mori

Yusuke Shinmen

Shigekazu Takeda

Toshiyuki Itou

A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150&#xb0; C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4'-oxydiphthalic acid dianhydride and a structure derived from 4,4&#x2032;-diaminodiphenyl ether; or (ii) a structure derived from 3,3&#x2032;4,4&#x2032;-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4&#x2032;-diaminodiphenyl ether; or (iii) a structure derived from 4,4&#x2032;-oxydiphthalic acid dianhydride and a structure derived from 2,2&#x2032;-dimethyl-4,4&#x2032;-diaminobiphenyl.

Photosensitive resin composition, polyimide production method, and semiconductor device

A photosensitive resin composition, ensuring that after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and a high-adhesion polyimide layer is obtained, and a polyimide using the photosensitive resin composition, can be provided. Furthermore, a semiconductor device in which after a high-temperature storage test, a void is less likely to be generated at the interface of a Cu layer in contact with a polyimide layer and short circuiting or disconnection following a high-temperature storage test is unlikely to occur. A photosensitive resin composition is characterized by including a component (A) as a photosensitive polyimide precursor, and a component (B) containing a structure represented by formula (B1). (In formula (B1), Z is a sulfur or oxygen atom, and each of Rto Rindependently represents a hydrogen atom or a monovalent organic group).

Provided are: a polyacrylonitrile-based precursor fiber for the production of a carbon fiber having a large single-fiber fineness, said precursor fiber ensuring high heat stability of a spinning dope and excellent productivity; and a copolymer suitable for the production of said precursor fiber. Also provided are: high-quality carbon fiber bundles which have a large single-fiber fineness and excellent productivity; a process for producing the same; and a process for producing flameproofed fiber bundles suitable for the production of the carbon fiber bundles. A polyacrylonitrile-based copolymer which comprises 93.0 to 99.4 mol % of acrylonitrile units, 0.5 to 4.0 mol % of (meth)acrylamide-based units, and 0.1 to 3.0 mol % of unsaturated carboxylic acid hydroxyalkyl ester units and in which the (meth)acrylamide-based units are (meth)acrylamide units and/or (meth)acrylamide derivative units having a molecular weight of 105 or less; a precursor fiber comprising the copolymer; a process for producing flameproofed fiber bundles which uses precursor fiber bundles consisting of the precursor fiber; carbon fiber bundles; and a process for production thereof.

Polyacrylonitrile-based copolymer, polyacrylonitrile-based precursor fiber for carbon fiber, carbon fiber bundles, process for producing stabilized fiber bundles, and process for producing carbon fiber bundles

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Tokyo, Japan

Harumi Matsuda