Endwell, NY, United States of America

Harold Kohn


Average Co-Inventor Count = 1.9

ph-index = 9

Forward Citations = 357(Granted Patents)


Company Filing History:


Years Active: 1983-1999

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14 patents (USPTO):Explore Patents

Title: The Innovations of Harold Kohn: A Glimpse into His Patents and Contributions

Introduction

Harold Kohn is a notable inventor based in Endwell, NY, recognized for his significant contributions to the field of electrical engineering. With a total of 14 patents to his name, Kohn has played a vital role in advancing technology, particularly in modular circuit design and manufacturing processes.

Latest Patents

Among Kohn's latest patents is the "Modular circuit package having vertically aligned power and signal cores." This inventive modular structure provides electrical interconnections that enhance wiring density through chemical processes, such as lithography, rather than mechanical methods. The core of this invention features a power core made of apertured metallic foil with an insulator, allowing for effective electrical connections while offering mechanical stiffness.

Another significant patent is the "Manufacturing solder-preform holders for a pick-and-place machine." This process involves a method where rectangular preforms are vacuum picked and flawlessly positioned in a holder before applying no-clean flux and solder. This innovation not only streamlines the manufacturing process but also reduces environmental hazards by eliminating the need for solvents and CFCs in circuit board production.

Career Highlights

Harold Kohn has made his mark in the industry while working with the International Business Machines Corporation (IBM). His expertise and innovative mindset have not only contributed to his patents but have also laid the groundwork for future advancements in electrical engineering.

Collaborations

Throughout his career, Harold Kohn has collaborated with esteemed colleagues, such as Kishor V Desai and Nelson P Franchak. These collaborations have resulted in impactful innovations and remain a testament to the power of teamwork in driving technology forward.

Conclusion

Harold Kohn's contributions to the world of inventions and patents reflect his dedication to innovation and engineering excellence. His latest work in modular circuit packages and solder-preform manufacturing not only demonstrates his expertise but also sets the stage for ongoing advancements in the field. As technology continues to evolve, Kohn's legacy will undoubtedly inspire future inventors and engineers.

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