The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 1996

Filed:

Sep. 21, 1994
Applicant:
Inventors:

Kishor V Desai, Vestal, NY (US);

Harold Kohn, Endwell, NY (US);

Richard C Senger, Vestal, NY (US);

Donald P Seraphim, Vestal, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
29852 ; 29830 ; 29840 ; 29843 ; 174263 ; 2281801 ; 427 97 ; 428901 ;
Abstract

A multi-layer printed circuit board or card including a plurality of circuitized power cores, the circuitized power cores include a layer of an electrically conductive material having a layer of electrically insulating material attached on both sides thereof. The circuitized power cores also include a plurality of plated through holes formed therethrough in substantially the same pattern on each circuitized power core. The circuitized power cores are parallel to each other such that corresponding plated through holes in the two circuitized power cores are co-linear. A plurality of substantially spherical balls are located between the circuitized power cores and are in contact with the corresponding plated through holes on facing cards. The balls have a diameter slightly larger than the opening of the plated through holes and are made of an electrically conductive material.


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