Hyderabad Telangana, India

Harinatha Reddy Ramireddy

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.5

ph-index = 1


Company Filing History:


Years Active: 2025

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4 patents (USPTO):Explore Patents

Title: Harinatha Reddy Ramireddy: Innovator in Chiplet Technology

Introduction

Harinatha Reddy Ramireddy is a prominent inventor based in Hyderabad, Telangana, India. He has made significant contributions to the field of chiplet technology, holding a total of 4 patents. His work focuses on improving the reliability and efficiency of chiplet interconnections in computing devices.

Latest Patents

One of his latest patents is titled "Mechanism to improve the reliability of sideband in chiplets." This invention includes various methods and devices for implementing Universal Chiplet Interconnect Express (UCIe) link configuration for multi-module chiplets. The patent outlines a process for transitioning a UCIe link from an active state to a reset state while initializing different functional sidebands. Another notable patent is "Reduced training for main band chip module interconnection clock lines." This invention relates to methods for sending training patterns between modules of different dies, enhancing the communication efficiency through main band clock lines.

Career Highlights

Harinatha Reddy Ramireddy is currently employed at Qualcomm Incorporated, a leading company in semiconductor technology. His work at Qualcomm has positioned him as a key player in advancing chiplet technology, contributing to the development of innovative solutions that enhance computing performance.

Collaborations

Throughout his career, Harinatha has collaborated with talented individuals such as Ravindranath Doddi and Lekhya Pavani Godavarthi. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Harinatha Reddy Ramireddy is a distinguished inventor whose work in chiplet technology has the potential to revolutionize the computing industry. His patents reflect a commitment to enhancing the reliability and efficiency of chiplet interconnections, making significant strides in the field.

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