The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Jul. 14, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ravindranath Doddi, Hyderabad, IN;

Umamaheshwaran V, Salem, IN;

Afreen Haider, Muzaffarpur, IN;

Lekhya Pavani Godavarthi, Hyderabad, IN;

Harinatha Reddy Ramireddy, Hyderabad, IN;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); G06F 13/42 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4018 (2013.01); G06F 13/42 (2013.01);
Abstract

Aspects relate to an expanded data link width for a chip connection. In one example a sideband transmitter of a module of a first die is configured to send an expanded data link width enable request to a module partner through a sideband of a die-to-die connection to set an expanded data link width of a main band of the die-to-die connection. The expanded data link width includes data lines of the main band and redundant data lines of the main band reconfigured as data lines. A sideband receiver of the module is configured to receive an expanded data link width enable response from the module partner through the sideband to set the expanded data link width of the main band. A main band transmitter is configured to communicate data with the module partner through the main band using the expanded data link width.


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