Altheim, Austria

Harald Wiesbauer


 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Altheim, AT (2015 - 2016)
  • Ried im Innkreis, AT (2019 - 2021)

Company Filing History:


Years Active: 2015-2021

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5 patents (USPTO):Explore Patents

Title: Innovations by Harald Wiesbauer

Introduction

Harald Wiesbauer is a notable inventor based in Altheim, Austria. He has made significant contributions to the field of substrate bonding technologies. With a total of 5 patents to his name, Wiesbauer's work has advanced the methods used in various industrial applications.

Latest Patents

Wiesbauer's latest patents focus on innovative methods for bonding and debonding substrates. One of his key inventions is a method for creating a product-substrate-to-carrier-substrate bond. This method involves a connection layer that bonds a product substrate to a carrier substrate, with a soluble layer placed between them. The soluble layer is designed to dissolve when exposed to electromagnetic radiation, allowing for precise control over the bonding process. Another patent outlines a method for debonding a product substrate from a carrier substrate, utilizing the same principles of electromagnetic interaction. These inventions highlight Wiesbauer's expertise in developing efficient and effective bonding techniques.

Career Highlights

Wiesbauer is currently employed at Ev Group E. Thallner GmbH, where he continues to innovate in the field of substrate bonding. His work has been instrumental in enhancing the capabilities of the company's product offerings. His contributions have not only advanced the technology but have also positioned the company as a leader in the industry.

Collaborations

Throughout his career, Wiesbauer has collaborated with talented individuals such as Jurgen Burggraf and Markus Wimplinger. These partnerships have fostered a creative environment that encourages innovation and the development of groundbreaking technologies.

Conclusion

Harald Wiesbauer's contributions to substrate bonding technologies are significant and impactful. His innovative methods and collaborative spirit continue to drive advancements in the field. His work exemplifies the importance of innovation in modern technology.

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