The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Nov. 23, 2010
Jürgen Burggraf, Schärding, AT;
Harald Wiesbauer, Altheim, AT;
Markus Wimplinger, Ried am Innkreis, AT;
Jürgen Burggraf, Schärding, AT;
Harald Wiesbauer, Altheim, AT;
Markus Wimplinger, Ried am Innkreis, AT;
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Abstract
A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of <150 μm, especially <100 μm, preferably <75 μm, even more preferably <50 μm, especially preferably <30 μm, surface treatment of the flat side with means for reducing an especially structural intrinsic stress of the product wafer.