The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2016
Filed:
Mar. 18, 2013
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventors:
Jurgen Burggraf, Scharding, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Harald Wiesbauer, Altheim, AT;
Alfred Sigl, Ottmaring, DE;
Assignee:
EV Group E. Thallner GmbH, St. Florian, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 21/563 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/13 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27418 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27444 (2013.01); H01L 2224/27515 (2013.01); H01L 2224/27622 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73153 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8114 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83009 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01); H01L 2924/381 (2013.01);
Abstract
A method for tacking of chips onto a substrate at chip positions which are distributed on a surface of the substrate. The method includes the following steps: formation or application of a function layer onto the substrate, removing the function layer from the substrate at the chip positions at least in the region of contacts to uncover the contacts, tacking chips onto one chip contact side of the function layer at the chip positions and contacting the chips with the contacts via contact elements.