This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Ev Group E. Thallner Gmbh. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Alfred Sigl: Innovator in Chip Bonding Technology
Introduction
Alfred Sigl is a notable inventor based in Munich, Germany. He has made significant contributions to the field of chip bonding technology, holding a total of 2 patents. His work focuses on innovative methods and devices that enhance the efficiency and effectiveness of bonding chips onto substrates.
Latest Patents
One of his latest patents is a pressure transmitting device for bonding chips onto a substrate. This invention relates to a pressure transmission apparatus designed to bond multiple chips to a substrate. The apparatus includes a pressure body that applies a bonding force in the bonding direction. The pressure body features a first pressure side and an opposite second pressure side, both oriented transversely to the bonding direction. Additionally, fixing means are provided to secure the pressure transmission apparatus to a retaining body in the bonding direction. A sliding layer is also included to facilitate the sliding motion of the pressure body.
Another significant patent is a method for fastening chips with a contact element onto a substrate that has a functional layer with openings for the chip contact elements. This method involves several steps, including the formation of a functional layer on the substrate and the removal of this layer at specific chip positions to uncover the contacts. Chips are then tacked onto one side of the functional layer at designated positions, allowing for contact with the chips via contact elements.
Career Highlights
Alfred Sigl is currently employed at Ev Group E. Thallner GmbH, where he continues to develop innovative technologies in the field of semiconductor manufacturing. His expertise in chip bonding has positioned him as a key player in advancing the industry.
Collaborations
Throughout his career, Alfred has collaborated with notable colleagues, including Markus Wimplinger and Jurgen Burggraf. These collaborations have contributed to the development of cutting-edge technologies in chip bonding.
Conclusion
Alfred Sigl's contributions to chip bonding technology through his patents and work at Ev Group E. Thallner GmbH highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile