Ev Group E. Thallner Gmbh

Alfred Sigl

Markus Wimplinger

Jurgen Burggraf

Harald Wiesbauer

This invention relates to a pressure transmission apparatus for bonding a plurality of chips to a substrate. The pressure transmission apparatus includes a pressure body for applying a bonding force which acts in the bonding direction (B) to the chip. The pressure body has a first pressure side and an opposite second pressure side, both oriented to be transverse to the bonding direction (B). Fixing means are provided to attach to the periphery of the pressure transmission apparatus for fixing of the pressure transmission apparatus on a retaining body in the bonding direction (B). A sliding layer is provided for sliding motion of the pressure body transversely to the bonding direction (B).

Pressure transmitting device for bonding chips onto a substrate

A method for tacking of chips onto a substrate at chip positions which are distributed on a surface of the substrate. The method includes the following steps: formation or application of a function layer onto the substrate, removing the function layer from the substrate at the chip positions at least in the region of contacts to uncover the contacts, tacking chips onto one chip contact side of the function layer at the chip positions and contacting the chips with the contacts via contact elements.

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Munich, Georgia

Alfred Sigl