Seoul, South Korea

Hansung Ryu


Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 61(Granted Patents)


Location History:

  • Yongin-si, KR (2016 - 2017)
  • Incheon, KR (2021)
  • Seoul, KR (2018 - 2023)

Company Filing History:


Years Active: 2016-2025

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10 patents (USPTO):

Title: The Innovative Contributions of Hansung Ryu

Introduction

Hansung Ryu is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work has been instrumental in advancing the capabilities of semiconductor devices, which are essential components in modern electronics.

Latest Patents

Among his latest patents is a semiconductor package with a stiffener. This innovative package includes a substrate and a semiconductor stack mounted on it, with a stiffener surrounding the semiconductor stack. The stiffener features an octagonal shape at the edge of its upper surface, and the minimum distance from one angular point of the substrate to the stiffener is determined based on the substrate's thickness. Another notable patent is for a semiconductor device and method for manufacturing the same. This device includes a substrate with an insulating layer that has a trench, at least one via structure penetrating the substrate, and a conductive structure surrounding the via structure in the trench.

Career Highlights

Hansung Ryu is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to semiconductor technology.

Collaborations

Some of his notable coworkers include Chanho Lee and Hyunsoo Chung. Their collaborative efforts have led to advancements in semiconductor design and manufacturing processes.

Conclusion

Hansung Ryu's innovative work in semiconductor technology has made a lasting impact on the industry. His patents reflect his commitment to advancing electronic components, and his collaborations with other experts continue to drive progress in this vital field.

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