The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Jan. 28, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Hansung Ryu, Seoul, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/3672 (2013.01); H01L 23/562 (2013.01); H01L 25/0655 (2013.01);
Abstract
A semiconductor package includes a substrate, a semiconductor stack mounted on the substrate, and a stiffener surrounding the semiconductor stack, the stiffener having an octagonal shape at an edge of an upper surface thereof. A minimum distance from one angular point of an upper surface of the substrate to the stiffener is determined based on the thickness of the substrate.