Munich, Germany

Hans Hadersbeck


Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 148(Granted Patents)


Company Filing History:


Years Active: 1977-1990

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9 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Hans Hadersbeck

Introduction

Hans Hadersbeck is a notable inventor based in Munich, Germany. With a remarkable portfolio comprising nine patents, he has made significant strides in the field of electroplating and semiconductor technologies.

Latest Patents

Among his latest inventions is the "Electroplating apparatus for producing humps on chip components." This innovative design features an electroplating cell equipped with an anode, cathode, and diaphragm ring, all suspended in an electrolytic bath. The structure includes a plastic tube with an anode surface covering the lower opening and a wafer holder on the upper opening, holding the semiconductor wafer. Additionally, the apparatus incorporates activated carbon filtering aimed at achieving a leveling effect.

Another noteworthy patent is the "Manufacture of fine structures for semiconductor contacting." This method involves photographic structuring executed on both sides of a smooth, non-stressed metal tape. The tape undergoes etching from both sides, followed by single-sided metal deposition through float-type electroplating. The stabilization of fine structures is achieved by depositing a lacquer or resin via electrophoretic deposition or electro-immersion lacquering, with an insulator carrier applied as one of the final process steps.

Career Highlights

Hans Hadersbeck has made his mark by working with Siemens Aktiengesellschaft, a leading global company in the field of technology and engineering. His expertise has contributed to numerous advancements within the company, particularly in the technology related to semiconductors and electroplating.

Collaborations

Throughout his career, Hans has collaborated with talented colleagues like Ernst Andrascek and Alfred Groeber, working together to push the boundaries of innovation in their respective fields. These collaborations have not only enhanced his work but also expanded the reach of their collective inventions in the industry.

Conclusion

Hans Hadersbeck stands as a figure of innovation in the realm of electroplating and semiconductor technologies. His patents exemplify his commitment to improving existing technologies and contributing to advancements that will shape the future of the industry. As he continues his work at Siemens Aktiengesellschaft, the impact of his inventions will likely resonate through the developments in the technology sector for years to come.

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