Siemens Aktiengesellschaft

Hans Hadersbeck

Ernst Andrascek

Alfred Groeber

Hubert Zukier

Ferdinand Quella

Ernst Goepel

Hans-Juergen Hacke

Fritz Mueller

Hans J Hacke

Friedhelm Wallenhorst

The present invention provides an improved electroplating apparatus having an electroplating cell equipped with an anode, cathode and diaphragm ring. The electroplating cell is suspended in an electrolytic bath. The cell is composed of a plastic tube whose lower opening is covered by an anode surface and whose upper opening is covered by a wafer holder for holding the semiconductor wafer. The electroplating apparatus further includes an activated carbon filtering aimed at the levelling effect.

Electroplating apparatus for producing humps on chip components

A method for the manufacture of fine structures for semiconductors were in a photographic structuring is carried out on both sides of a smooth, non-stressed metal tape. The tape is etched from both sides. A single sided metal deposition than takes place by means of a float type electroplating. Stabilization of the fine structure is achieved by depositing a lacquer or resin by an electrophoretic deposition or by electro-immersion lacquering. The insulator carrier is applied as one of the final steps of the process.

Manufacture of fine structures for semiconductor contacting

A print head of an ink jet printer is formed by a multilayer structure composed of a plurality of individual photoplastic films, segments of such films having a prescribed contour being removed by a photo-chemical treatment being defined on the individual photoplastic films in successive lamination procedures by the use of masks through which such photoplastic films are exposed. Passivation of unexposed films takes place after every lamination procedure by applying a light-absorbing solution. A three-dimensional structure is built up employing photoplastic films having thicknesses in the range between 10 .mu.m to 50 .mu.m and one or more masks having light transmissive regions which define a desired cross-section for the interior passages of the print head.

Method of manufacture for print heads of ink jet printers

A method for producing a copper platform on integrated circuits formed on a semiconductor wafer wherein an aluminum layer is back-sputtered over the circuits to provide contact surfaces thereon, followed by sputtering on successive layers of titanium and copper on the aluminum layer. A copper platform is electrolytically built up above the aluminum layer and thereafter the copper layer is etched away. The copper platform is then metallized by electroless deposition, and finally the titanium layer is etched away.

Method of producing copper platforms for integrated circuits

A chemical gilding bath is formulated on the basis of an alkaline, aqueous solution of an alkali gold cyanide complex and has a reducing agent and a stabilizing agent therein. The reducing agent is an organic compound containing at least one enol group within the molecular structure thereof, such as ascorbic acid or salts thereof. The pH value of the bath is adjusted by a buffer solution so as to range between about 7.5 to 12 and preferably is about 8.

Chemical gilding bath

A printed circuit board has temperature-stable electric components, such as resistance networks, disposed on the soldering side of the circuit board. The components mounted on the soldering side of the board are mounted as a unit containing the network, which unit has a recess which partially surrounds the solder connection location of the circuit board, at which point the unitary component is electrically and mechanically connected to the board. The recesses are beveled to facilitate solder flow, and cover approximately half of the connection location of the circuit board.

Printed circiuit board

A process for the production of printed circuit boards having first zones of a wiring pattern for receiving solder and second sub-zones provided with solder rejecting properties so that they do not receive solder, characterized by galvanically applying a solderable etch-resistant metal layer on the first sub-zones of each conductive metal layer, by photo printing a mask of etch-resistant material on the second sub-zones, etching to remove the exposed portions of the conductive metal layer, removing the mask from the second sub-zones and providing the exposed second sub-zones with a solder rejecting property with the aid of passivation without impairing the solderability of the etch-resistant metal layers of the first sub-zones.

Process for the production of printed circuits with solder rejecting

A flexible printed circuit board has conductors on opposite sides thereof which are through-contacted by die-punching the board to form an angularly-displaced tongue portion about which solder is flowed to contact both conductors. A terminal pin is optionally inserted through the board to connect a component, the pin being engaged by the angularly-displaced tongue to ensure reliable mechanical and electrical contact in the soldered joint. The through-contact is formed with a bevel-faced die in conjunction with a cutting plate.

Flexible through-contacted printed circuits

A process is provided for improving the solderability of electric circuit boards with conductor paths composed of copper or copper alloys, in which, at least at the locations to be soldered, the conductor paths are cleansed in a first solution and are thereby deoxidized, and are then activated in a second solution.

Growing community of inventors

Munich, Germany

Hans Hadersbeck