The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 1990

Filed:

Feb. 08, 1988
Applicant:
Inventors:

Hans Hadersbeck, Munich, DE;

Ernst Andrascek, Munich, DE;

Assignee:

Siemens Aktiengesellschaft, Berlin and Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ;
U.S. Cl.
CPC ...
204238 ; 2042 / ;
Abstract

The present invention provides an improved electroplating apparatus having an electroplating cell equipped with an anode, cathode and diaphragm ring. The electroplating cell is suspended in an electrolytic bath. The cell is composed of a plastic tube whose lower opening is covered by an anode surface and whose upper opening is covered by a wafer holder for holding the semiconductor wafer. The electroplating apparatus further includes an activated carbon filtering aimed at the levelling effect.


Find Patent Forward Citations

Hadersbeck, Hans. (1990). Electroplating apparatus for producing humps on chip components (U.S. Patent No. 4906346). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4906346

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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