This inventor holds 5 USPTO granted patents. Top assignee: Siemens Aktiengesellschaft. Active years: 1977-1990.
Company Filing History:
Years Active: 1977-1990
Title: The Innovations of Ernst Andrascek
Introduction
Ernst Andrascek is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electroplating and semiconductor technology. With a total of 5 patents to his name, Andrascek's work has had a considerable impact on the industry.
Latest Patents
One of his latest patents is an "Electroplating apparatus for producing humps on chip components." This invention provides an improved electroplating apparatus featuring an electroplating cell equipped with an anode, cathode, and diaphragm ring. The electroplating cell is suspended in an electrolytic bath and is composed of a plastic tube, with the lower opening covered by an anode surface and the upper opening covered by a wafer holder for holding the semiconductor wafer. Additionally, the apparatus includes an activated carbon filtering aimed at achieving a leveling effect.
Another significant patent is the "Method of producing copper platforms for integrated circuits." This method involves producing a copper platform on integrated circuits formed on a semiconductor wafer. An aluminum layer is back-sputtered over the circuits to provide contact surfaces, followed by the sputtering of successive layers of titanium and copper on the aluminum layer. A copper platform is electrolytically built up above the aluminum layer, which is then etched away. The copper platform is subsequently metallized by electroless deposition, and finally, the titanium layer is etched away.
Career Highlights
Ernst Andrascek is currently associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to innovate and develop advanced technologies in the field of electroplating and semiconductor manufacturing.
Collaborations
Throughout his career, Andrascek has collaborated with notable colleagues such as Hans Hadersbeck and Alfred Groeber. These collaborations have contributed to the advancement of technology in their respective fields.
Conclusion
Ernst Andrascek's contributions to the field of electroplating and semiconductor technology are noteworthy. His innovative patents and work at Siemens highlight his role as a significant inventor in the industry. His advancements continue to influence the development of modern technologies.