The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1987
Filed:
Aug. 20, 1985
Applicant:
Inventors:
Ernst Andrascek, Munich, DE;
Hans Hadersbeck, Munich, DE;
Assignee:
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F / ; B44C / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
156652 ; 29591 ; 156656 ; 1566591 ; 156664 ; 156666 ; 204 15 ; 204 385 ; 2041923 ; 20419235 ; 357 71 ; 427 90 ;
Abstract
A method for producing a copper platform on integrated circuits formed on a semiconductor wafer wherein an aluminum layer is back-sputtered over the circuits to provide contact surfaces thereon, followed by sputtering on successive layers of titanium and copper on the aluminum layer. A copper platform is electrolytically built up above the aluminum layer and thereafter the copper layer is etched away. The copper platform is then metallized by electroless deposition, and finally the titanium layer is etched away.