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For the Inventor, By the Inventor

Seoul, South Korea

Hae-Jung Yu

USPTO Granted Patents = 11 

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 64(Granted Patents)


Location History:

  • Seoul, KR (2014 - 2023)
  • Hwaseong-si, KR (2024)

Company Filing History:

goldMedal11 out of 131,766 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2014-2025

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11 patents (USPTO):Explore Patents
1. 12218070 - Semiconductor package and method of fabricating the same (2025-02-04),
2. 12080676 - Semiconductor package including a molding layer (2024-09-03),
3. 11935867 - Semiconductor package with memory stack structure connected to logic dies via an interposer (2024-03-19),
4. 11637070 - Method of fabricating a semiconductor package (2023-04-25),
5. 11282792 - Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads (2022-03-22),
6. 10854551 - Semiconductor package and method of fabricating the same (2020-12-01),
7. 9245867 - Package-on-package electronic devices including sealing layers and related methods of forming the same (2016-01-26),
8. 9245863 - Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights (2016-01-26),
9. 9054228 - Semiconductor packages including a heat spreader and methods of forming the same (2015-06-09),
10. 8912048 - Method of fabricating semiconductor device including a substrate attached to a carrier (2014-12-16),
11. 8779606 - Package-on-package electronic devices including sealing layers and related methods of forming the same (2014-07-15),

Title: Hae-Jung Yu: Innovator in Semiconductor Technology

Introduction

Hae-Jung Yu is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on innovative semiconductor packages that enhance performance and efficiency.

Latest Patents

Among his latest patents is a semiconductor package and method of fabricating the same. This invention includes a redistribution layer with a first surface and a second surface, featuring a plurality of first redistribution pads on the first surface. A semiconductor chip is positioned on the second surface, with its active surface facing the redistribution layer. The design incorporates conductive structures that are spaced apart from the semiconductor chip, along with external connection terminals coupled to these structures. Notably, the first redistribution pads have a pitch smaller than that of the external connection terminals. Another significant patent involves a semiconductor package that includes a first semiconductor chip with a mount region and an overhang region. This package features a substrate on the bottom surface of the mount region and a molding layer that covers the substrate and the sidewalls of both the substrate and the semiconductor chip.

Career Highlights

Hae-Jung Yu is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

He has collaborated with notable coworkers, including Kyung Suk Oh and Choongbin Yim, who have also contributed to the innovative projects at Samsung.

Conclusion

Hae-Jung Yu's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His inventions continue to influence the development of advanced semiconductor packages, showcasing the importance of innovation in technology.

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