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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9245867 B1

PDFFull Text
Date of Patent:
Jan. 26, 2016

Filed:

May. 28, 2014

Package-on-package electronic devices including sealing layers and related methods of forming the same

Applicants:

Choongbin Yim, Cheonan-si, KR;

Hae-jung Yu, Seoul, KR;

Taesung Park, Cheonan-si, KR;

Inventors:

Choongbin Yim, Cheonan-si, KR;

Hae-Jung Yu, Seoul, KR;

Taesung Park, Cheonan-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Myers Bigel Sibley & Sajovec, P.A.

Primary Examiner:

A Sefer

Assistant Examiner:

Dilinh Nguyen

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/563 (2013.01); H01L 23/10 (2013.01); H01L 25/105 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer.

Find Patent Forward Citations

Yim, Choongbin. (2016). Package-on-package electronic devices including sealing layers and related methods of forming the same (U.S. Patent No. 9245867). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9245867

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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