The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Mar. 14, 2013
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Jong-Youn Kim, Seoul, KR;
Ji-Hwang Kim, Bucheon-si, KR;
Hae-Jung Yu, Seoul, KR;
Cha-Jea Jo, Bucheon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A method of fabricating a semiconductor device includes attaching a semiconductor substrate to a carrier using a carrier fixing layer, where the semiconductor substrate including a plurality of semiconductor chips. The method further includes forming gaps between adjacent ones of the chips. The gaps may be formed using one or more chemicals or light which act to remove portions of the semiconductor substrate to expose the carrier fixing layer. Additional portions of the carrier fixing layer are then removed to allow for removal of the chips from the carrier.