Company Filing History:
Years Active: 2002-2009
Title: Innovations by Guido Wenski in Semiconductor Technology
Introduction
Guido Wenski is a prominent inventor based in Burghausen, Germany, known for his significant contributions to semiconductor technology. With a total of 10 patents to his name, Wenski has developed innovative methods that enhance the efficiency and quality of semiconductor wafer production.
Latest Patents
Among his latest patents is a method for machining a semiconductor wafer on both sides in a carrier. This method allows for the simultaneous reduction of the wafer's thickness from both the front and back surfaces. The semiconductor wafer is guided in a cutout in a carrier, ensuring that it is thinner than the carrier body while being protected by an inlay. This innovative approach results in polished semiconductor wafers with exceptional local flatness. Another notable patent involves an epitaxially coated semiconductor wafer and the process for producing it. This process includes simultaneous polishing of both surfaces of the wafer and the deposition of an epitaxial layer, achieving remarkable surface roughness and flatness.
Career Highlights
Wenski has worked with leading companies in the semiconductor industry, including Siltronic AG and Wacker Siltronic Gesellschaft für Halbleiter Materialien AG. His experience in these organizations has contributed to his expertise in semiconductor manufacturing processes.
Collaborations
Throughout his career, Wenski has collaborated with notable colleagues such as Gerhard Heier and Thomas Altmann. These partnerships have fostered innovation and advancements in semiconductor technologies.
Conclusion
Guido Wenski's contributions to semiconductor technology through his patents and collaborations have significantly impacted the industry. His innovative methods continue to enhance the production and quality of semiconductor wafers, showcasing his expertise and dedication to advancing technology.