The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2003
Filed:
Nov. 17, 2000
Guido Wenski, Burghausen, DE;
Wacker Siltronic Gesellschaft für Halbleitermaterialien AG, Burghausen, DE;
Abstract
A process for producing a multiplicity of semiconductor wafers, which includes the following individual steps: (a) simultaneous polishing a front side and a back side of each semiconductor wafer between rotating polishing plates with a polishing fluid being supplied, the semiconductor wafer in each case resting in a cutout in a carrier and being kept on a specific geometric path, and all semiconductor wafers having a thickness t following the polishing; (b) assessment of each semiconductor wafer with regard to quality features which are stipulated for further processing; (c) further simultaneous polishing a front side and a back side of each of those semiconductor wafers which, according to quality inspection (b), do not satisfy the stipulated quality features, these semiconductor wafers having a thickness t following the further polishing; and (d) further assessment of each of those semiconductor wafers which were fed to step (c) with regard to quality features stipulated for further processing.