Madison, WI, United States of America

Gregory P Dado

This inventor holds 2 USPTO granted patents and 1 published patent application, plus 1 CIPO patent. Top assignee: 3M Innovative Properties Company. Active years: 1992-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gregory P Dado. Retrieved from https://idiyas.com/inventor/gregory-p-dado

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Location History:

  • Madison, WI (US) (1992)
  • Dane, WI (US) (1996)

Company Filing History:


Years Active: 1992-1996

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2 patents (USPTO):Explore Patents

Title: Gregory P Dado: Innovator in Multi-Chip Substrate Technology

Introduction

Gregory P Dado is a notable inventor based in Madison, WI (US), recognized for his contributions to the field of microelectronics. He holds 2 patents that showcase his innovative approach to interconnect substrates.

Latest Patents

Dado's latest patents focus on multi-chip substrates. The first patent describes an interconnect substrate comprising a metal-polymer composite that incorporates microelectronic circuitry. This substrate is characterized by alternating layers of thermoset and thermoplastic resins, with thermoplastic resins designed to withstand high temperatures. The thermoset resins are selected from a group that includes bismaleimides and thermosetting polyimides, among others. The durable base of this substrate enhances its functionality in microelectronic applications.

The second patent also pertains to a multi-chip substrate, emphasizing an economical construction method. This substrate includes a multilevel metal-polymer composite that incorporates microelectronic circuitry. The design allows for alternating layers of thermoset and thermoplastic resins, ensuring that each layer is free from reactive groups with copper. The arrangement of these layers is optimized for machinability, allowing for effective planarization of the interconnect.

Career Highlights

Gregory P Dado is currently associated with 3M Innovative Properties Company, where he continues to develop advanced technologies in the field of microelectronics. His work has significantly contributed to the evolution of interconnect substrates, making them more efficient and reliable.

Collaborations

Dado has collaborated with notable coworkers such as Jeanne M Tingerthal and Lafayette D Foland, contributing to a dynamic team focused on innovation in microelectronics.

Conclusion

Gregory P Dado's work in multi-chip substrate technology exemplifies his commitment to advancing microelectronic applications. His patents reflect a deep understanding of materials and engineering principles, positioning him as a key figure in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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