The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 07, 1996
Filed:
Dec. 05, 1991
Jeanne M Tingerthal, Ramsey, MN (US);
Gregory P Dado, Dane, WI (US);
Minnesota Mining and Manufacturing Company, St. Paul, MN (US);
Abstract
An interconnect substrate comprising a metal-polymer composite incorporating microelectronic circuitry, which interconnect substrate is characterized by the feature that the polymer comprises alternating layers of thermoset and thermoplastic resins, said thermoplastic resins being resistant to the highest temperature to which the interconnect substrate may be heated, said thermoset resins being selected from the group consisting of bismaleimides, thermosetting polyimides, benzocyclobutenes and cyanate esters, said thermoplastic resin being selected from the group consisting of preimidized polyetherimides, and polyesters including polyacrylates, polyamides, polyvinylacetals, and phenoxy resins, said substrate having a durable base.