Minnesota Mining and Manufacturing Company

Gregory P Dado

Jeanne M Tingerthal

Dawn Friesen

An interconnect substrate comprising a metal-polymer composite incorporating microelectronic circuitry, which interconnect substrate is characterized by the feature that the polymer comprises alternating layers of thermoset and thermoplastic resins, said thermoplastic resins being resistant to the highest temperature to which the interconnect substrate may be heated, said thermoset resins being selected from the group consisting of bismaleimides, thermosetting polyimides, benzocyclobutenes and cyanate esters, said thermoplastic resin being selected from the group consisting of preimidized polyetherimides, and polyesters including polyacrylates, polyamides, polyvinylacetals, and phenoxy resins, said substrate having a durable base.

Multi-chip substrate

An interconnect substrate that includes a multilevel metal-polymer composite incorporating microelectronic circuitry should be economical to construct when the polymer comprises alternating layers of thermoset and thermoplastic resins, each of which is substantially free from groups that are reactive with copper. The layers of thermoset and thermoplastic resins can either alternate in adjacent levels, or each level can include both a layer of thermoset resin and a layer of thermoplastic resin. When each level includes either a thermoset resin or a thermoplastic resin, each such resin preferably has good machinability to permit each level of the interconnect to be planarized mechanically. When there is a layer of thermoset resin and a layer of thermoplastic resin in each level, the thermoplastic resin preferably is at the surface of each level, because a thermoplastic resin usually has better machinability than do thermoset resins.

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Madison, WI, United States of America

Gregory P Dado