The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 1992
Filed:
Jul. 27, 1990
Jeanne M Tingerthal, White Bear Lake, MN (US);
Gregory P Dado, Madison, WI (US);
Minnesota Mining and Manufacturing Company, St. Paul, MN (US);
Abstract
An interconnect substrate that includes a multilevel metal-polymer composite incorporating microelectronic circuitry should be economical to construct when the polymer comprises alternating layers of thermoset and thermoplastic resins, each of which is substantially free from groups that are reactive with copper. The layers of thermoset and thermoplastic resins can either alternate in adjacent levels, or each level can include both a layer of thermoset resin and a layer of thermoplastic resin. When each level includes either a thermoset resin or a thermoplastic resin, each such resin preferably has good machinability to permit each level of the interconnect to be planarized mechanically. When there is a layer of thermoset resin and a layer of thermoplastic resin in each level, the thermoplastic resin preferably is at the surface of each level, because a thermoplastic resin usually has better machinability than do thermoset resins.