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For the Inventor, By the Inventor

Hopewell Junction, NY, United States of America

Gobinda Das

USPTO Granted Patents = 10

Average Co-Inventor Count = 3.3

ph-index = 9

Forward Citations = 306(Granted Patents)


Location History:

  • Beacon, NY (US) (1978)
  • Hopewell Junction, NY (US) (1991 - 2013)

Company Filing History:

goldMedal10 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1978-2013

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10 patents (USPTO):
1. 8524596 - Techniques for improving bond pad performance (2013-09-03),
2. 7007380 - TFI probe I/O wrap test method (2006-03-07),
3. 6731128 - TFI probe I/O wrap test method (2004-05-04),
4. 6426636 - Wafer probe interface arrangement with nonresilient probe elements and support structure (2002-07-30),
5. 6411112 - Off-axis contact tip and dense packing design for a fine pitch probe (2002-06-25),
6. 6156484 - Gray scale etching for thin flexible interposer (2000-12-05),
7. 5973928 - Multi-layer ceramic substrate decoupling (1999-10-26),
8. 5059553 - Metal bump for a thermal compression bond and method for making same (1991-10-22),
9. 5053851 - Metal bump for a thermal compression bond and method for making same (1991-10-01),
10. 4069068 - Semiconductor fabrication method for improved device yield by minimizing (1978-01-17),

Title: Innovations by Gobinda Das in Semiconductor Technology

Introduction

Gobinda Das, based in Hopewell Junction, NY, is a notable inventor with a remarkable portfolio consisting of 10 patents. His innovative contributions primarily focus on improving the performance and reliability of semiconductor technologies, making significant strides in the field.

Latest Patents

Among his latest patents, Gobinda Das has introduced groundbreaking techniques that enhance bond pad performance. These techniques involve a method of forming a bond pad where at least one alloying element is selectively introduced and diffused into the bond pad through thermal cycles. Such advancements aim to optimize the bond pad's functionality and reliability. Additionally, he developed a TFI probe I/O wrap test method, which provides an effective means for testing external connections to semiconductor devices, ensuring robust performance in various applications.

Career Highlights

Gobinda Das currently serves at the International Business Machines Corporation (IBM), renowned for its innovative advancements in technology. His career at IBM has been marked by numerous innovative projects that underline his commitment to enhancing semiconductor technology.

Collaborations

In his work, Gobinda collaborates with talented peers including Franco Motika and Steven J Duda, contributing to a team environment that fosters creativity and innovation. Their collective expertise has propelled numerous projects to success at IBM.

Conclusion

Gobinda Das is a significant figure in the realm of semiconductor innovations. His patents not only reflect his technical expertise but also his dedication to advancing the technology that underpins modern electronics. With ongoing collaborations and a focus on innovation, Gobinda Das remains an influential inventor in the industry.

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