The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Jul. 16, 2012
Frederic Beaulieu, Granby, CA;
Gobinda Das, Hopewell Junction, NY (US);
Steven J. Duda, Underhill Center, VT (US);
Matthew J. Farinelli, Riverdale, NY (US);
Adreanne Kelly, Philadelphia, PA (US);
Samuel Mcknight, New Paltz, NY (US);
William J. Murphy, N. Ferrisburg, VT (US);
Frederic Beaulieu, Granby, CA;
Gobinda Das, Hopewell Junction, NY (US);
Steven J. Duda, Underhill Center, VT (US);
Matthew J. Farinelli, Riverdale, NY (US);
Adreanne Kelly, Philadelphia, PA (US);
Samuel McKnight, New Paltz, NY (US);
William J. Murphy, N. Ferrisburg, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Techniques for bond pad fabrication are provided. In one aspect, a method of forming a bond pad comprises the following steps. At least one alloying element is selectively introduced to at least a portion of at least one surface of the bond pad. The at least one alloying element is diffused into at least a portion of the bond pad through one or more thermal cycles. The at least one alloying element may be selectively introduced to the bond pad by depositing an alloying element layer comprising the at least one alloying element onto the bond pad and patterning and etching at least a portion of the layer.