Company Filing History:
Years Active: 1990
Title: Gianni Berner: Innovator in Integrated Circuit Technology
Introduction
Gianni Berner is a notable inventor based in Baden, Switzerland. He has made significant contributions to the field of electronics, particularly in the development of highly integrated circuits. With a total of 2 patents to his name, Berner's work has advanced the capabilities of electronic devices.
Latest Patents
One of Berner's latest patents is titled "Highly integrated circuit and method for the production thereof." This invention focuses on a semiconductor chip that is fastened on a substrate, which projects only a few millimeters beyond the chip. The design allows for full dynamic testing of the circuit before insertion, utilizing connections arranged outside the substrate edge. This innovative approach enables the realization of circuits with a greatly reduced space requirement while ensuring thorough testing.
Another significant patent is "Electronic circuit and method of production thereof." This patent describes an electronic circuit featuring flip-chip mounting of a semiconductor chip on a substrate. A metallic solder stop layer is provided between the chip and the substrate's conductor tracks, insulated by an oxide layer. This design allows for reproducible layer thickness, resulting in reliable flip-chip soldering.
Career Highlights
Gianni Berner is currently associated with Contraves AG, a company known for its advancements in technology and engineering. His work at Contraves AG has allowed him to push the boundaries of electronic circuit design and production.
Collaborations
Berner collaborates with Karl-Peter Ackermann, a fellow innovator in the field. Their partnership has contributed to the development of cutting-edge technologies in integrated circuits.
Conclusion
Gianni Berner's contributions to the field of electronics through his patents and work at Contraves AG highlight his role as a key innovator. His advancements in integrated circuit technology continue to influence the industry and pave the way for future innovations.