The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 1990
Filed:
Jul. 07, 1989
Applicant:
Inventor:
Gianni Berner, Baden, CH;
Assignee:
Contraves AG, Zurich, CH;
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361400 ; 29843 ; 29860 ; 361406 ;
Abstract
An electronic circuit with flip-chip mounting of a semiconductor chip (5) on a substrate (1), wherein there is provided between the semiconductor chip (5) and the conductor tracks (2) of the substrate (1) a metallic solder stop layer (3) which is insulated from its environment by an oxide layer (4). With this type of solder stop layer, it is possible to obtain layer thickness which can be exactly reproduced, as a result of which a reliable flip-chip soldering is achieved.