Contraves Ag

Gianni Berner

Karl-Peter Ackermann

In a highly integrated circuit the semiconductor chip (8) is fastened on a substrate (17) which projects on all sides only a few millimeters beyond the semiconductor chip (8). For Full dynamic testing of the circuit before insertion, connections are provided which are arranged outside the projecting substrate edge (23) with a sufficiently large grid spacing. In a first embodiment (FIG. 2D) 'lost' test connections (5) are used which are separated after testing. In a second embodiment (FIG. 3E), contact areas in the form of bumps (21) are used for testing which are arranged on the underside of the through-holes (18) lying in the chip mounting area. In this manner it is possible to realize a circuit with greatly reduced space requirement, which at the same time can be fully tested dynamically before insertion.

Highly integrated circuit and method for the production thereof

An electronic circuit with flip-chip mounting of a semiconductor chip (5) on a substrate (1), wherein there is provided between the semiconductor chip (5) and the conductor tracks (2) of the substrate (1) a metallic solder stop layer (3) which is insulated from its environment by an oxide layer (4). With this type of solder stop layer, it is possible to obtain layer thickness which can be exactly reproduced, as a result of which a reliable flip-chip soldering is achieved.

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Baden, Switzerland

Gianni Berner