Graz, Austria

Gernot Schulz

USPTO Granted Patents = 9 

 

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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9 patents (USPTO):

Title: Gernot Schulz: Innovator in Electronic Packaging Technology

Introduction

Gernot Schulz is a prominent inventor based in Graz, Austria. He has made significant contributions to the field of electronic packaging technology, holding a total of 9 patents. His innovative work focuses on methods and products that enhance the efficiency and functionality of electronic components.

Latest Patents

Among his latest patents, Gernot has developed a method of manufacturing a component carrier and a component carrier intermediate product. This invention includes a first electrically-insulating layer structure and a second electrically-insulating layer structure that is partially uncured and patterned with recesses filled by an electrically-conductive material. Additionally, he has patented a method for creating an electronic package that encapsulates an electronic component in a pressureless manner. This method involves placing an electronic component on a layer structure, encapsulating it with an encapsulant, and forming a stack beneath the encapsulated component.

Career Highlights

Gernot Schulz is currently employed at AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of high-tech printed circuit boards and electronic solutions. His work at AT&S has allowed him to push the boundaries of electronic packaging technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Gernot has collaborated with notable colleagues, including Marco Gavagnin and Alexander Kasper. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Gernot Schulz is a key figure in the realm of electronic packaging, with a strong portfolio of patents that reflect his expertise and innovative spirit. His contributions continue to shape the future of electronic components and packaging solutions.

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