At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Gernot Schulz

Marco Gavagnin

Markus Leitgeb

Jonathan Silvano De Sousa

Gernot Grober

Heinz Moitzi

Erich Schlaffer

Mike Morianz

Thomas Krivec

Alexander Kasper

Ferdinand Lutschounig

Elisabeth Kreutzwiesner

Michael Ortner

Rainer Frauwallner

Ravi Hanyal Shivarudrappa

Martin Lenzhofer

Markus Maier

Gernot Gmundner

Hubert Haidinger

A component carrier intermediate product includes a first electrically-insulating layer structure; an at least partially uncured and patterned second electrically-insulating layer structure having recesses, wherein the recesses are filled by an electrically-conductive material; and a component carrier section arranged on the at least partially uncured and patterned second electrically-insulating layer structure.

Method of manufacturing component carrier and component carrier intermediate product

A method of manufacturing an electronic package is disclosed. The described method includes (a) placing an electronic component on at least one layer structure; (b) encapsulating the electronic component by an encapsulant in a pressureless way; and (c) forming at least one further layer structure at the layer structure to thereby form a stack beneath the encapsulated electronic component. A further described electronic package includes (a) a stack comprising at least one layer structure and at least one further layer structure; (b) an electronic component being placed on the stack; and (c) an encapsulant encapsulating the electronic component, wherein the encapsulant has been formed in a pressureless way. Further described is an electronic device comprising such an electronic package.

Package with embedded electronic component being encapsulated in a pressureless way

A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.

Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummies

A component carrier with an integrated magnetic field sensor is disclosed. The component carrier includes a plurality of electrically conductive layer structures and/or electrically insulating layer structures; an excitation coil and sensor coils arranged on and/or in the layer structures; a first magnetic structure above the excitation coil and sensor coils; and a second magnetic structure below the excitation coil and sensor coils.

Component carrier with integrated flux gate sensor

A component carrier with a double layer structure is illustrated and described. The double layer structure includes an electrically conductive patterned layer structure and a further patterned layer structure made of a two-dimensional material. The patterned layer structure and the further patterned layer structure have at least partly the same pattern. In an embodiment the component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and at least one double layer structure connected with the stack.

Component carrier comprising a double layer structure

A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.

Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions

The invention relates to a printed circuit board structure with at least one dielectric insulating layer and at least one conductive layer, in which within the at least one insulating layer, a layer made of a dielectric thermally conductive material is provided that is located at least in the vicinity of, or in contact with, an inner conductor arrangement. Another thermally conductive layer, preferably an electrically conductive metal layer, can be provided in the immediate vicinity of, or in contact with, the layer made of a dielectric thermally conductive material. It is also possible for an at least thermally conductive, preferably electrically conductive feedthrough to pass from a conductor section lying on the outside of the printed circuit board into the inside of the printed circuit board, at least into the vicinity of the layer made of a dielectric thermally conductive material.

Printed circuit board structure

A mounting device for mounting electronic components, wherein the mounting device comprises a stack, in particular a layer stack configured as alternating sequence of at least one support structure for providing mechanical support and a plurality of thermally conductive and electrically insulating structures.

Mechanically stable, thermally conductive and electrically insulating stack forming a mounting device for electronic components

A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

Growing community of inventors

Graz, Austria

Gernot Schulz