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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11058007 B1

PDFFull Text
Date of Patent:
Jul. 06, 2021

Filed:

Nov. 06, 2018

Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions

Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Marco Gavagnin, Leoben, AT;

Markus Leitgeb, Trofaiach, AT;

Alexander Kasper, Graz, AT;

Gernot Schulz, Graz, AT;

Assignee:

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Attorneys:

Robert A. Blaha

Smith Tempel Blaha LLC

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01L 21/4857 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H05K 1/028 (2013.01); H05K 3/4664 (2013.01); H05K 3/4697 (2013.01); H01L 2224/18 (2013.01); H05K 1/185 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/1476 (2013.01);
Abstract

A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.

Find Patent Forward Citations

Gavagnin, Marco. (2021). Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions (U.S. Patent No. 11058007). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11058007

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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